Japan's Rapidus foundry is pursuing a comeback strategy with plans to begin 2nm mass production in Hokkaido by H2 2027, building on pilot production already underway at its IIM-1 fab. The company is also scaling advanced chiplet packaging capabilities to handle multi-die integration. This addresses both technical requirements and Japan's geopolitical interest in sovereign semiconductor capacity.
Infrastructure
When the IBM PC and shoulder pads were big, Japan led the chip industry. It's trying to get back there now
Rapidus is targeting 2nm mass production in Hokkaido by H2 2027, backing Japan's push to reclaim semiconductor sovereignty after decades of losing ground to competitors.
Tuesday, April 14, 2026 12:00 PM UTC2 MIN READSOURCE: The RegisterBY sys://pipeline
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